Method of Manufacturing Phase-Change Material (PCM) Radio Frequency (RF) Switch Using a Chemically Protective and Thermally Conductive Layer

ABSTRACT

A radio frequency (RF) switch includes a heating element, an aluminum nitride layer situated over the heating element, and a phase-change material (PCM) situated over the aluminum nitride layer. An inside segment of the heating element underlies an active segment of the PCM, and an intermediate segment of the heating element is situated between a terminal segment of the heating element and the inside segment of the heating element. The aluminum nitride layer situated over the inside segment of the heating element provides thermal conductivity and electrical insulation between the heating element and the active segment of the PCM. The aluminum, nitride layer extends into the intermediate segment of the heating element and provides chemical protection to the intermediate segment of the heating element, such that the intermediate segment of the heating element remains substantially unetched and with substantially same thickness as the inside segment.

CLAIMS OF PRIORITY

The present application is a continuation-in-part of and claims thebenefit of and priority to application Ser. No. 16/103,490 filed on Aug.14, 2018, titled “Manufacturing RF Switch Based on Phase-ChangeMaterial.” The present application is also a continuation-in-part of andclaims the benefit of and priority to application Ser. No. 16/103,646filed on Aug. 14, 2018, titled “PCM RF Switch Fabrication withSubtractively Formed Heater.” The present application is further acontinuation-in-part of and claims the benefit of and priority toapplication Ser. No. 16/114,106 filed on Aug. 27, 2018, titled“Fabrication of Contacts in an RF Switch Having a Phase-Change Material(PCM) and a Heating Element.” The disclosures and contents of all of theabove-identified applications are hereby incorporated fully by referenceinto the present application.

BACKGROUND

Phase-change materials (PCM) are capable of transforming from acrystalline phase to an amorphous phase. These two solid phases exhibitdifferences in electrical properties, and semiconductor devices canadvantageously exploit these differences. Given the ever-increasingreliance on radio frequency (RF) communication, there is particular needfor RF switching devices to exploit phase-change materials. However, thecapability of phase-change materials for phase transformation dependsheavily on how they are exposed to thermal energy and how they areallowed to release thermal energy. For example, in order to transforminto an amorphous state, phase-change materials may need to achievetemperatures of approximately seven hundred degrees Celsius (700° C.) ormore, and may need to cool down within hundreds of nanoseconds.

At such high temperatures, minor differences in PCM switch structurescan have significant impacts on thermal energy management, especially inminiaturized devices. Natural process variations can ruin reliability ofPCM switches by shorting them, increasing their operating voltage, ordecreasing their tolerance to stress/strain. Accordingly, accommodatingPCM in RF switches can present significant manufacturing challenges.Specialty manufacturing, is often impractical, and large scalemanufacturing generally trades practicality for the ability to controldevice characteristics and critical dimensions.

Thus, there is a need in the art for highly reliable low voltagephase-change material (PCM) RF switches.

SUMMARY

The present disclosure is directed to phase-change material (PCM) radiofrequency (RF) switches using a chemically protective and thermallyconductive layer, substantially as shown in and/or described inconnection with at least one of the figures, and as set forth in theclaims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A illustrates a top view of a portion of a phase-change material(PCM) radio frequency (RF) switch structure processed according to anaction according to one implementation of the present application.

FIGS. 1B and 1C each illustrate a cross-sectional view of a portion of aPCM RF switch structure corresponding to the PCM RF switch structure ofFIG. 1A according to one implementation of the present application.

FIG. 2A illustrates a top view of a portion of a PCM RF switch structureprocessed according to an action according to one implementation of thepresent application.

FIGS. 2B and 2C each illustrate a cross-sectional view of a portion of aPCM RF switch structure corresponding to the PCM RF switch structure ofFIG. 2A according to one implementation of the present application.

FIG. 3A illustrates a top view of a portion of a PCM RF switch structureprocessed according to an action according to one implementation of thepresent application.

FIGS. 3B and 3C each illustrate a cross-sectional view of a portion of aPCM RF switch structure corresponding to the PCM RF switch structure ofFIG. 3A according to one implementation of the present application.

FIG. 4A illustrates a top view of a portion of a PCM RF switch structureprocessed according to an action according to one implementation of thepresent application.

FIGS. 4B and 4C each illustrate a cross-sectional view of a portion of aPCM RF switch structure corresponding to the PCM RF switch structure ofFIG. 4A according to one implementation of the present application.

FIG. 5 illustrates a cross-sectional view of a portion of a PCM RFswitch structure processed according to an alternate implementation ofthe present application.

FIG. 6A illustrates a top view of a portion of a PCM RF switch structureprocessed according to an action according to one implementation of thepresent application.

FIGS. 6B and 6C each illustrate a cross-sectional view of a portion of aPCM RF switch structure corresponding to the PCM RF switch structure ofFIG. 6A according to one implementation of the present application.

DETAILED DESCRIPTION

The following description contains specific information pertaining toimplementations in the present disclosure. The drawings in the presentapplication and their accompanying detailed description are directed tomerely exemplary implementations. Unless noted otherwise, like orcorresponding elements among the figures may be indicated by like orcorresponding reference numerals. Moreover, the drawings andillustrations in the present application are generally not to scale, andare not intended to correspond to actual relative dimensions.

FIG. 1A illustrates a top view of a portion of a phase-change material(PCM) radio frequency (RF) switch structure processed according to anaction according to one implementation of the present application. ThePCM RF switch structure shown in FIG. 1A includes heating element 102having inside segment 104, intermediate segments 106, and terminalsegments 108, and lower dielectric 110. For purposes of illustration,the top view in FIG. 1A shows selected structures. The PCM RF switchstructure may include other structures not shown in FIG. 1A.

In FIG. 1A, a heating element is provided. Heating element 102 generatesa crystallizing pulse or an amorphizing pulse for transforming an activesegment of PCM, as described below. Heating element 102 can comprise anymaterial capable of Joule heating. Preferably, heating element 102comprises a material that exhibits minimal or substantially noelectromigration, thermal stress migration, and/or agglomeration. Invarious implementations, heating element 102 can comprise tungsten ON),molybdenum (Mo), titanium (Ti), titanium nitride (TiN), titaniumtungsten (TiW), tantalum (Ta), nickel chromium (NiCr), or nickelchromium silicon (NiCrSi). Heating element 102 may be formed by adamascene process, a subtractive etch process, or any other suitableprocess. Lower dielectric 110 is adjacent to the sides of heatingelement 102. In various implementations, lower dielectric 110 is siliconoxide (SiO₂), silicon nitride (Si_(X)N_(Y)), or another dielectric.

Heating element 102 extends along the PCM RF switch structure in FIG.1A, and includes inside segment 104, intermediate segments 106, andterminal segments 108. Inside segment 104 is approximately centeredalong heating element 102. As used in the present application, “insidesegment” refers to a segment of heating element 102 that is situatedunder PCM, as described below. Terminal segments 108 are situated atends of the extension of heating element 102. In the presentimplementation, terminal segments 108 have a larger area than insidesegment 104. In other implementations, terminal segments 108 may haveany other size or shape. Terminal segments 108 provide segments where aheating element contact for heating element 102 may connect, asdescribed below. Intermediate segments 106 are situated between insidesegment 104 and terminal segments 108. In the present implementation,intermediate segments 106 are substantially continuous with insidesegment 104.

FIG. 1B illustrates a cross-sectional view of a portion of a PCM RFswitch structure corresponding to the PCM RF switch structure of FIG. 1Aaccording to one implementation of the present application. FIG. 1Brepresents a cross-sectional view along line “B-B” in FIG. 1A. The PCMRF switch structure shown in FIG. 1B includes inside segment 104, lowerdielectric 110, heat spreader 112, and substrate 114.

Lower dielectric 110 is adjacent to the sides of inside segment 104 andis substantially coplanar with inside segment 104. In the presentimplementation, lower dielectric 110 extends along the width of the PCMRF switch structure, and is also situated under inside segment 104. Invarious implementations, lower dielectric 110 can have a relative widthand/or a relative thickness greater or less than shown in FIG. 1B.

Heat spreader 112 is situated under inside segment 104 and lowerdielectric 110. Heat spreader 112 generally dissipates excess heatgenerated by a PCM RF switch. In particular, heat spreader 112dissipates excess heat generated by heating element 102 (shown FIG. 1A)after a heat pulse, such as a crystallizing pulse or an amorphizingpulse has transformed the state of the PCM RF switch to an ON state oran OFF state. Heat spreader 1112 can comprise any material with highthermal conductivity. In one implementation, heat spreader 112 cancomprise a material with both high thermal conductivity and highelectrical resistivity. In various implementation, heat spreader 112 cancomprise silicon (Si), aluminum nitride (AlN), aluminum oxide(Al_(X)O_(Y)), beryllium oxide (Be_(X)O_(Y)), silicon carbide (SiC),diamond, or carbon.

Substrate 114 is situated under heat spreader 112 in one implementation,substrate 114 is an insulator, such as SiO₂. In variousimplementations,substrate 114 is a silicon (Si), silicon-on-insulator(SOI), sapphire, complementary metal-oxide-semiconductor (CMOS), bipolarCMOS (BiCMOS), or group III-V substrate. Substrate 114 can haveadditional layers not shown in FIG. 1B. In one implementation, heatspreader 112 itself performs as a substrate and a separate substrate isnot used. For example, heat spreader 112 can comprise Si and be providedwithout substrate 114. In one implementation, heat spreader 112 can beintegrated with substrate 114.

FIG. 1C illustrates a cross-sectional view of a portion of a PCM RFswitch structure corresponding to the PCM RF switch structure of FIG. 1Aaccording to one implementation of the present application. FIG. 1Crepresents a cross-sectional view along line “C-C” in FIG. 1A. The PCMRF switch structure shown in FIG. 1C includes heating element havinginside segment 104, intermediate segments 106, and terminal segments108, lower dielectric 110, heat spreader 112, and substrate 114.

The PCM RF switch structure in FIG. 1C is similar to the PCM RF switchstructure in FIG. 1B, except that the PCM RF switch structure in FIG. 1Cillustrates an entire extension of heating element 102, including insidesegment 104, intermediate segments 106, and terminal segments 108,rather than just inside segment 104. Heating element 102 generates acrystallizing pulse or an amorphizing pulse for transforming an activesegment of PCM, as described below. Lower dielectric 110 is adjacent tothe sides of heating element 102 and is substantially coplanar withheating element 102. In the present implementation, lower dielectric 110extends along the width of the PCM RF switch structure, and is alsosituated under heating element 102. Heat spreader 112 is situated underheating element 102 and lower dielectric 110. Substrate 114 is situatedunder heat spreader 112.

FIG. 2A illustrates a top view of a portion of PCM RF switch structureprocessed according to an action according to one implementation of thepresent application. In FIG. 2A, heating element 102 is illustrated withdashed lines to indicate that it does not lie on top of the PCM RFswitch structure in FIG. 2A, and is instead seen through variousstructures. For purposes of illustration, the top view in FIG. 2A showsselected structures. The PCM RF switch structure may include otherstructures not shown in FIG. 2A.

In FIG. 2A, aluminum nitride layer 116 is formed over heating element102. Aluminum nitride layer 116 can be deposited, for example, byphysical vapor deposition (PVD), chemical vapor deposition (CVD), orplasma enhanced chemical vapor deposition (PECVD). Aluminum nitridelayer 116 has high thermal conductivity and high electrical resistivity.As described below, aluminum nitride layer 116 provides thermalconductivity and electrical insulation between inside segment 104 andoverlying PCM (not shown in FIG. 2A) and improves both the thermalperformance and the RF performance of a PCM RF switch. Aluminum nitridelayer 116 also has high etch selectivity to a fluorine-based etchant. Asdescribed below, aluminum nitride layer 116 provides chemical protectionto heating element 102 and improves the reliability the PCM RF switch.

As indicated by outline 117 a in FIG. 2A, aluminum nitride layer 116extends over heating element 102 and its nearby areas. In anotherimplementation, aluminum nitride layer 116 can extend over a largerarea. Outline 117 b is included in FIG. 2A to indicate that aluminumnitride layer 116 can extend over a larger area, such as over an entirewafer. In another implementation, aluminum nitride layer 116 can extendover a smaller area. Outline 117 c is included in FIG. 2A to indicatethat aluminum nitride layer 116 can extend over a smaller area, such asover inside segment 104 and its nearby areas. Other thermally conductiveand electrically insulating materials having high etch selectively toother etch chemistries can be used in place of aluminum nitride layer116. In various implementations, aluminum oxide (Al_(X)O_(Y)), berylliumoxide (Be_(X)O_(Y)), silicon carbide (SIC), diamond, or diamond-likecarbon can be used in place of aluminum nitride layer 116.

FIG. 2B illustrates a cross-sectional view of a portion of a PCM RFswitch structure corresponding to the PCM RF switch structure of FIG. 2Aaccording to one implementation of the present application. FIG. 2Brepresents a cross-sectional view along line “B-B” in FIG. 2A.

Aluminum nitride layer 116 is situated over inside segment 104 and overlower dielectric 110, and is substantially planar. Aluminum nitridelayer 116 provides thermal conductivity and electrical insulationbetween inside segment 104 and overlying PCM (not shown in FIG. 2B).Because aluminum nitride layer 116 has high thermal conductivity,aluminum nitride layer 116 efficiently conducts heat from a heat pulsegenerated by inside segment 104. Additionally, because aluminum nitridelayer 116 is substantially planar and situated over inside segment 104,aluminum nitride layer 116 conducts heat from the heat pulse upwardtoward overlying PCM (not shown in FIG. 2B). If instead aluminum nitridelayer 116 were non-planar, and were situated adjacent to sides of insidesegment 104 as well as over inside segment 104, then aluminum nitridelayer 116 would conduct heat from the heat pulse upward lessefficiently, because heat would flow laterally from the sides of insidesegment 104. In other implementations, aluminum nitride layer 116 can benon-planar. In one implementation, aluminum nitride layer 116 can have athickness of approximately five hundred angstroms to approximately fivethousand angstroms (500 Å-5000 Å). Aluminum nitride layer 116 having athickness in this range may represent an optimization of two performancefactors for a PCM RF switch, as described below.

The portion of aluminum nitride layer 1:1.6 situated over inside segment104 can have a significantly different thermal conductivity than theportion of aluminum nitride layer 116 situated over lower dielectric110. The different thermal conductivities can be achieved, for example,by controlling the grain size and/or crystal orientation of the aluminumnitride layer 116, or the grain size and/or crystal orientation ofunderlying structures. The portion of aluminum nitride layer 116situated over inside segment 104 can be made to have thermalconductivity higher than the portion of aluminum nitride layer 116situated over lower dielectric 110, such that aluminum nitride layer 116increases heat flow from inside segment 104 upward in a direction towardoverlying PCM (not shown in FIG. 2B), and decreases lateral heat flowfrom inside segment 104. In various implementations, various layers formodifying the thermal conductivity of aluminum nitride layer 116 can beintroduced between inside segment 104 and aluminum nitride layer 116and/or between lower oxide 110 and aluminum nitride layer 116.

FIG. 2C illustrates a cross-sectional view of a portion of a PCM RFswitch structure corresponding to the PCM RF switch structure of FIG. 2Aaccording to one implementation of the present application. FIG. 2Crepresents a cross-sectional view along line “C-C” in FIG. 2A.

The PCM RF switch structure in FIG. 2C is similar to the PCM RF switchstructure in FIG. 2B, except that the PCM RF switch structure in FIG. 2Cillustrates an entire extension of heating element 102. Aluminum nitridelayer 116 is situated over heating element 102 and over lower dielectric110, and is substantially planar. Aluminum nitride layer 116 providesthermal conductivity and electrical insulation between heating element102 and overlying PCM (not shown in FIG. 2C) and improves both thethermal performance and the RF performance of a PCM RF switch, asdescribed below. Aluminum nitride layer 116 also provides chemicalprotection to heating element 102 and improves the reliability the PCMRF switch, as described below.

FIG. 3A illustrates a top view of a portion of PCM RF switch structureprocessed according to an action according to one implementation of thepresent application. In FIG. 3A, heating element 102 is illustrated withdashed lines to indicate that it does not lie on top of the PCM RFswitch structure in FIG. 3A, and is instead seen through variousstructures. For purposes of illustration, the top view in FIG. 3A showsselected structures. The PCM RF switch structure may include otherstructures not shown in FIG. 3A.

In FIG. 3A, PCM 118 is formed over aluminum nitride layer 116 (shown inFIG. 2A), and mask 120 is formed over PCM 118 overlying inside segment104 of heating element 102. In response to a crystallizing or anamorphizing heat pulse generated by heating element 102, PCM 118 cantransform from a crystalline phase that easily conducts electricalcurrent to an amorphous phase that does not easily conduct electricalcurrent, and thus, can transform the state of a PCM RF switch to an ONstate or an OFF state. PCM 118 can be germanium telluride(Ge_(X)Te_(Y)), germanium antimony telluride (Ge_(X)Sb_(Y)Te_(Z)),germanium selenide (Ge_(X)Se_(Y)), or any other chalcogenide. In variousimplementations, PCM 118 can be germanium telluride having from fortypercent to sixty percent germanium by composition (i.e., G _(X)Te_(Y),where 0.4≤X≤0.6 and Y=1−X). The material for PCM 118 can be chosen basedupon ON state resistivity, OFF state electric field breakdown threshold,crystallization temperature, melting temperature, or otherconsiderations. PCM 118 can be deposited, for example, by PVDsputtering, CVD, evaporation, or atomic layer deposition (ALD). Mask 120determines a maximum channel area of a PCM RF switch, and a maximumseparation of PCM contacts (not shown in FIG. 3A).

FIG. 3B illustrates a cross-sectional view of a portion of a PCM RFswitch structure corresponding to the PCM RF switch structure of FIG. 3Aaccording to one implementation of the present application. FIG. 3Brepresents a cross-sectional view along line “B-B” in FIG. 3A.

Optional conformability support layer 122 is situated over aluminumnitride layer 116. Optional conformability support layer 122 is ahomogenous layer that allows PCM 118 to be formed substantially uniformwith respect to that layer. In various implementations, optionalconformability support layer 122 comprises SiO₂ and/or Si_(X)N_(Y).Optional conformability support layer 122 can be formed, for example, byPECVD or HDP-CVD. In one implementation, optional conformability supportlayer 122 can have a thickness of approximately fifty angstroms toapproximately five hundred angstroms (50 Å-500 Å).

PCM 118 is situated over optional conformability support layer 122 (incase optional conformability support layer 122 is utilized) and overaluminum nitride layer 116. As shown in FIG. 3B, because aluminumnitride layer 116 is substantially planar, PCM 118 is also substantiallyplanar. In other implementations, aluminum nitride layer 116 can benon-planar. In one implementation, PCM 118 can have a thickness ofapproximately five hundred angstroms to approximately two thousandangstroms (500 Å-2000 Å). In other implementations, PCM 118 can have anyother thicknesses. The thickness of PCM 118 can be chosen based uponsheet resistance, crystallization power, amorphization power, or otherconsiderations.

Optional contact uniformity support layer 124 is situated over PCM 118.Optional contact uniformity support layer 124 allows PCM 118 to remainsubstantially intact during formation of PCM contacts (not shown in FIG.3B), as described below. In various implementations, optional contactuniformity support layer 124 comprises SiO₂ and/or Si_(X)N_(Y). Optionalcontact uniformity support layer 124 can be formed, for example, byPECVD or HDP-CVD. In one implementation, optional contact uniformitysupport layer 124 can have a thickness of approximately fifty angstromsto approximately two thousand angstroms (50 Å-2000 Å).

Mask 120 is formed over optional contact uniformity support layer 124(in case optional contact uniformity support layer 124 is utilized) andover PCM 118. Mask 120 determines a maximum channel area of a PCM RFswitch, and a maximum separation of PCM contacts (not shown in FIG. 3A).

FIG. 3C illustrates a cross-sectional view of a portion of a PCM RFswitch structure corresponding to the PCM RF switch structure of FIG. 3Aaccording to one implementation of the present application. FIG. 3Crepresents a cross-sectional view along line “C-C” in FIG. 3A.

The PCM RF switch structure in FIG. 3C is similar to the PCM RF switchstructure in FIG. 3B, except that the PCM RF switch structure in FIG. 3Cillustrates an entire extension of heating element 102. Optionalconformability support layer 122, substantially planar PCM 118, optionalcontact uniformity support layer 124, and mask 120 are subsequentlysituated over aluminum nitride layer 116. As shown in FIG. 3C, mask 120is substantially aligned with inside segment 104 of heating element 102.

FIG. 4A illustrates a top view of a portion of PCM RF switch structureprocessed according to an action according to one implementation of thepresent application. In FIG. 4A, heating element 102 is illustrated withdashed lines to indicate that it does not lie on top of the PCM RFswitch structure in FIG. 4A, and is instead seen through variousstructures. For purposes of illustration, the top view in FIG. 4A showsselected structures. The PCM RF switch structure may include otherstructures not shown in FIG. 4A.

In FIG. 4A, PCM 118 is defined and mask 120 (shown in FIG. 3A) isremoved. Heating element 102 extends transverse to PCM 118. PCM 118includes active segments 126 and passive segments 128. As used herein,“active segment” refers to a segment of PCM that transforms betweencrystalline and amorphous states, for example, in response to heatpulses, whereas “passive segment” refers to a segment of PCM that doesnot make such transformation and maintains a crystalline state (i.e.maintains a conductive state). Active segment 126 of PCM 118 overliesinside segment 104 of heating element 102. Intermediate segments 106 ofheating element 102 are situated between terminal segments 108 andinside segment 104. Aluminum nitride layer 116 is situated over heatingelement 102 and under PCM 118.

FIG. 4B illustrates a cross-sectional view of a portion of a PCM RFswitch structure corresponding to the PCM RF switch structure of FIG. 4Aaccording to one implementation of the present application. FIG. 4Brepresents a cross-sectional view along line “B-B” in FIG. 4A.

Portions of optional conformability support layer 122, PCM 118, andoptional contact uniformity support layer 124 are removed in the regionsoutside of mask 120 (shown in FIG. 3B). As a result, inside segment 104of heating element 102 underlies active segment 126 of PCM 118, andpassive segments 128 of PCM 118 extend outward from active segment 126.In contrast, portions of aluminum nitride layer 116 are not removed inthe regions outside of mask 120 (shown in FIG. 3B). In oneimplementation, a fluorine-based plasma dry etch is used to selectivelyetch optional conformability support layer 122, PCM 118, and optionalcontact uniformity support layer 124, and aluminum nitride layer 116performs as an etch stop. In this implementation, using a fluorine-basedplasma dry etch may be preferable since the etch rate of PCM 118 influorine-based etchants is significantly higher than the etch rate ofaluminum nitride layer 116 in fluorine-based etchants. However, anyother technique may be used to form optional conformability supportlayer 122, PCM 118, and optional contact uniformity support layer 124 asshown in FIG. 4B, as long as aluminum nitride layer 116 provideschemical protection to underlying structures of the PCM RF switchstructure in FIG. 4B.

Continuing by referring to FIG. 4B, it is shown that planarity of lowerdielectric 110 and aluminum nitride layer 116, causes conformabilitysupport layer 122, PCM 118, and contact uniformity support layer 124 tobe also planar. In particular, PCM 118 assumes a planar, i.e. a flat,configuration. If lower dielectric 110 and aluminum nitride layer 116were not planar and were conformally formed over heating element 102,each layer, for example, lower dielectric 110 and aluminum nitride layer116, would assume the shape of the topography under it, resulting in anuneven shape, e.g., a hump,where each layer passes over heating element102. According to the present implementation of the present application,the planar formation of lower dielectric 110 and aluminum nitride layer116, which in turn results in planarity (i.e. flatness) of PCM 118,presents several significant advantages over implementations that arenon-planar, i.e. implementations where PCM 118 assumes the uneven shapeof the topography under PCM 118, for example, the bump presented byheating element 102.

First, since PCM 118 is in effect a resistor whose value should bepredictably set in both the ON and OFF states of the PCM RF switch, theplanar layout of PCM 118 in the PCM RF switch in FIG. 4B results insignificantly improved predictability of the resistance value of PCM 118in both the ON and OFF states. One reason is that the planar, i.e. flat,layout of PCM 118 is a substantially constant-length resistor. Anon-flat topography that is conformal to topographic variations underPCM 118 (for example, a bump caused by heating element 102), results ina relatively unpredictable resistance value of PCM 118, due to thevariable topography of PCM 118 resulting from a “bumpy” shape of PCM118, and would change depending on thickness of heating element 102, thewidth of heating element 102 (resulting in different heights for stepcoverage), and the thickness of the layers formed between heatingelement 102 and PCM 118, as well as process variations and variations instep coverage in those layers. These variations and unpredictabilitiesare substantially eliminated by the planar configuration of PCM 118shown in the PCM RF switch in FIG. 4B.

Second, the planar PCM RF switch, such as that shown in FIG. 4B, ismechanically more reliable and has a higher mechanical integrityrelative to non-planar implementations. In a non-planar configuration,the mechanical reliability and integrity of PCM 118 is adverselyaffected. For example, there would be increased likelihood of cracks andvoids due to a non-planar configuration. Further, as the number ofON/OFF electrical cyclings during operation of the PCM RF switchincreases, so does the likelihood for crack and void formation due tothe associated thermal cyclings and thermal stress and the resultingnon-uniform expansion and contraction of the non-planar layers, and inparticular the non-planar PCM.

Third, the planar PCM RF switch, such as that shown in FIG. 4B,maintains a more predictable electrical performance and an improvedreliability. In non-planar configurations of PCM in a PCM. RF switch,current crowding can occur, for example, in the corners or in the stepsexisting in the non-planar topography, which would lead to unpredictabledegradation and variations in electrical performance, and also potentialreliability problems.

Fourth, the planar PCM RF switch, such as that shown in FIG. 4B, resultsin improved reliability due to reduction or elimination of non-uniformheating of the PCM. In non-planar topologies, the current crowdingeffect referred to above can result in non-uniform heating in the PCM.The non-uniform heating can lead to early failure or a less robustswitch depending on the applied voltage or the power level experiencedby the PCM RF switch. As such, the voltage and power operational rangeof the PCM RF switch would have to be limited, relative to the planarPCM RF switch, such as that shown in FIG. 4B—which can operate in awider range of voltage and power.

FIG. 4C illustrates a cross-sectional view of a portion of a PCM RFswitch structure corresponding to the PCM RF switch structure of FIG. 4Aaccording to one implementation of the present application. FIG. 4Crepresents a cross-sectional view along line “C-C” in FIG. 4A.

The PCM RF switch structure in FIG. 4C is similar to the PCM RF switchstructure in FIG. 4B, except that the PCM RF switch structure in FIG. 4Cillustrates an entire extension of heating element 102, including insidesegment 104, intermediate segments 106, and terminal segments 108.Portions of optional conformability support layer 122, PCM 118, andoptional contact uniformity support layer 124 are removed in the regionsoutside of mask 120 (shown in FIG. 3C). As a result, inside segment 104of heating element 102 underlies. PCM 118. In contrast, portions ofaluminum nitride layer 116 are not removed in the regions outside ofmask 120 (shown in FIG. 3C). As described above, aluminum nitride layer116 provides chemical protection to underlying structures of the PCM RFswitch structure in FIG. 4C while optional conformability support layer122, PCM 118, and optional contact uniformity support layer 124 areformed. In particular, aluminum nitride layer 116 provides chemicalprotection to intermediate segments 106 and terminal segments 108 ofheating element 102, which would not be protected by mask 120 (shown inFIG. 3C). Thus, intermediate segments 106 and terminal segments 108 ofheating element 102 remain substantially unetched and with substantiallysame thickness as said inside segment 104. As shown in FIG. 4C, insidesegment 104, intermediate segments 106, and terminal segments 108 allhave thickness t1, and their top surfaces remain, planar and unetched.

FIG. 5 illustrates a cross-sectional view of a portion of a PCM RFswitch structure processed according to an alternate implementation ofthe present application. The PCM RF switch structure in FIG. 5represents an alternate implementation of the PCM RF switch structure inFIG. 4C, wherein non-protective dielectric 140 is used instead ofaluminum nitride layer 116. Non-protective dielectric 140 provideselectrical insulation between inside segment 104 and overlying PCM 118,and may or may not have high thermal conductivity. However,non-protective dielectric 140 does not provide chemical protectionunderlying structures when portions of optional conformability supportlayer 122, PCM 118, and optional contact uniformity support layer 124are removed in the regions outside of mask 120 (shown in FIG. 3C).Non-protective dielectric 140 can have low etch selectivity to afluorine-based etchant. In various implementations, non-protectivedielectric 140 is SiO₂, Si_(X)N_(Y), or another dielectric. In oneimplementation, non-protective dielectric 140 can have a thickness ofapproximately three hundred angstroms to approximately one thousandangstroms (300 Å-1000 Å). In FIG. 5, when portions of optionalconformability support layer 122, PCM 118, and optional contactuniformity support layer 124 are removed in the regions outside of mask120 (shown in FIG. 3C), corresponding portions of non-protectivedielectric 140 are also removed, and several defects or faults canoccur.

First, intermediate segments 106 and terminal segments 108 of heatingelement 102 can become undesirably etched. For example, fluorine-basedetchants that etch through PCM 1118 and non-protective dielectric 140can also etch through a tungsten heating element. It may not be possibleto accurately time the etching process to stop precisely at the topsurface of heating element 102. As shown in FIG. 5, intermediatesegments 106 and terminal segments 108 are undesirably etched. Incontrast, inside segment 104 of heating element 102 is substantiallyunetched. Thus, intermediate segments 106 and terminal segments 108 havethickness t2, which is less than thickness t1 of inside segment 104.Because heating element 102 requires high currents to generate heatpulses, heating element 102 is particularly sensitive to variations inthickness. Thinner intermediate segments 106 will heat significantlymore than thicker inside segment 104. The increased heat of thinnerintermediate segments 106 represents wasted power, since the heat ofinside segment 104 primarily transforms PCM 118. Heating element 102will require much higher applied pulse power in order for inside segment104 to transform PCM 11$. Furthermore, if intermediate segments 106overheat, heating element 1102 can become permanently damaged and thePCM RF switch may fail to function.

Second, depending on the techniques used to define optionalconformability support layer 122, PCM 118, and optional contactuniformity support layer 124, heating element 102 can be damaged. Asshown in FIG. 5, damaged surface 142 can occur when non-protectivedielectric 140 is used instead of aluminum nitride layer 116, Damagedsurface 142 causes heating element 102 to heat unevenly due variationsin thickness. Damaged surface 142 weakens heating element 102, allowingit to break more easily. Damaged surface 142 also makes it difficult touniformly contact terminal segments 108 with heating element contacts(not shown in FIG. 5).

Third, the PCM RF switch can short. For example, a natural result ofetching PCM 118 using fluorine-based etchants is that stringers, such asstringer 144, will form at an edge of PCM 118. Stringer 144 can coupleto heating element 102 and cause a short. PCM 118, which should beconducting an RF signal, would be undesirably electrically connected toheating element 102, which should be conducting a joule heating current,which would result in a major fault in the PCM RF switch function andoperation.

FIG. 6A illustrates a top view of a portion of PCM RF switch structureprocessed according to an action according to one implementation of thepresent application. In FIG. 6A, heating element 102 is illustrated withdashed lines to indicate that it does not lie on top of the PCM RFswitch structure in FIG. 6A, and is instead seen through variousstructures. For purposes of illustration, the top view in FIG. 6A showsselected structures. The PCM RF switch structure may include otherstructures not shown in FIG. 6A.

In FIG. 6A, PCM contacts 130 are formed over passive segments 128 of PCM118, and heating element contacts 132 are formed over terminal segments108 of heating element 102. In various implementations, input/outputcontacts 352 can comprise tungsten (W), copper (Cu), aluminum (Al),titanium (Ti), titanium nitride (TiN), or other metals. FIG. 6A alsoillustrates active segment 126 of PCM 118 situated over inside segment104 of heating element 102, intermediate segments 106 of heating element102 extending between inside segment 104 and terminal segments 108, andaluminum nitride layer 116 situated over heating element 102 and underPCM 118.

FIG. 6B illustrates a cross-sectional view of a portion of a PCM RFswitch structure corresponding to the PCM RF switch structure of FIG. 4Aaccording to one implementation of the present application. FIG. 6Brepresents a cross-sectional view along line “B-B” in FIG. 6A.

PCM contacts 130 are situated in contact dielectric 134 and over passivesegments 128 of PCM 118. In this implementation, forming PCM contacts130 may comprise two different etching actions. In the first etchingaction, contact dielectric 134 can be aggressively etched to form mostof the PCM contact holes. This first etching action can use a selectiveetch, and optional contact uniformity support layer 124 can perform asan etch stop. In the second etching action, optional contact uniformitysupport layer 124 can be etched less aggressively. As a result, PCM 118will remain substantially intact, and PCM contacts 130 can uniformlycontact PCM 118. Notably, because PCM 118 is planar, uniformlycontacting PCM 118 using PCM contacts 130 is simplified. Because theR_(ON) of a PCM RF switch depends heavily on the uniformity of contactsmade with PCM 118, the R_(ON) will be significantly lower when optionalcontact uniformity support layer 124 is used in one implementation,optional contact uniformity support layer 124 is substantially thinnerthan contact dielectric 134.

Aluminum nitride layer 116 has high thermal conductivity and is able toprovide several advantages. First, because aluminum nitride layer 116has high thermal conductivity, aluminum nitride layer 116 efficientlyconducts heat from a heat pulse generated by inside segment 104.Additionally, where aluminum nitride layer 116 is substantially planarand situated over inside segment 104, aluminum nitride layer 116conducts heat from the heat pulse upward toward overlying PCM 118. Thisimproved heat transfer allows active segment 126 of PCM 118 to transformat a lower applied pulse power, and allows the PCM RF to switch betweenON sand OFF states at a lower applied pulse power.

Second, this improved heat transfer decreases stresses and strains inthe switch. Because lower applied pulse powers can be used, less thermalexpansion occurs in heating element 102. This reduces thermal expansionstresses and strains in the switch, thereby improving reliability.

Third, this improved heat transfer also transforms more PCM 118,increasing the size of active region 126. This increased size of activeregion increases the breakdown voltage of the PCM RF switch in the OFFstate. In one implementation, the breakdown voltage of the PCM RF switchstructure in FIG. 6B may be double the breakdown voltage of the PCM RFswitch structure FIG. 5.

Fourth, aluminum nitride layer 116 also efficiently transfers heatgenerated by PCM 118 away from PCM 118. In the ON state, when activesegment 128 of PCM 118 is in a crystalline state, the PCM RF switchstructure in FIG. 6B propagates an RF signal between PCM contacts 130through PCM 118. PCM 118 generates heat from Joule heating when the RFsignal propagates through PCM 118. Aluminum nitride layer 116efficiently transfers this heat away. This improved heat transfer allowsthe switch to operate at a lower steady-state temperature, making theswitch suitable for hot-switching applications and higher power handlingapplications.

Aluminum nitride layer 116 also has high electrical resistivity and isable to provide several advantages. First, the added electricalinsulation of aluminum nitride layer 116 reduces parasitic capacitivecoupling between PCM contacts 130 and inside segment 104 and/or betweenPCM 118 and inside segment 104, thereby reducing a total insertion lossof the switch in the ON state and reducing a total OFF state parasiticcapacitance (C_(OFF)) of the switch in the OFF state. Thicker aluminumnitride layer 116 will reduce parasitic capacitive coupling, but willalso increase the applied pulse power required to transform activeregion 126 of PCM 118. However, beyond a certain thickness, aluminumnitride layer 116 sees diminishing advantage with regard to parasiticcapacitive coupling. Beyond a certain thickness, the applied pulse powerrequired to transform active region 126 of PCM 118 will continue toincrease, but the parasitic capacitive coupling between PCM contacts 130and inside segment 104 and/or between PCM 118 and inside segment 104will only minimally reduce or will substantially not reduce. Thus, thethickness of aluminum nitride layer 116 can be selected based on anoptimization of two performance factors for the PCM RF switch.

Second, aluminum nitride layer 116 decreases the chance an RF signalwill shunt. In the ON state, an RF signal can leak from PCM contacts 130through PCM 118 to inside segment 104, which may provide an electricalpath to ground through pulsing circuitry (not shown in FIG. 6B) and/orsubstrate 114. The added electrical insulation of aluminum nitride layer116 reduces the chance an RF signal will shunt. Additionally, where PCM118 is substantially planar, the signal path between PCM contacts 130 isdirect, and the chance an RF signal will shunt is further reduced.

FIG. 6C illustrates a cross-sectional view of a portion of a PCM RFswitch structure corresponding to the PCM RF switch structure of FIG. 6Aaccording to one implementation of the present application. FIG. 6Crepresents a cross-sectional view along line “C-C” FIG. 6A.

Heating element contacts 132 are situated in contact dielectric 134 andover terminal segments 108 of heating element 102. In thisimplementation, forming heating element contacts 132 may comprise twodifferent etching actions. In the first etching action, contactdielectric 134 can be aggressively etched to form most of the heatingelement contact holes. This first etching action can use a selectiveetch, example, a fluorine-based plasma dry etch, and aluminum nitridelayer 116 can perform as an etch stop. In the second etching action,aluminum nitride layer 116 can be etched less aggressively, for example,using chlorine-based plasma dry etch. As a result, terminal segments 108of heating element 102 will remain substantially unetched and withsubstantially the same thickness as intermediate segments 106 and insidesegment 104.

In the present implementation, after heating element contacts 132 areformed, aluminum nitride layer 116 fully extends over intermediatesegments 106 and partially extends over terminal segments 108 therebyproviding chemical protection to both intermediate segments 106 terminalsegments 108. In various implementation, aluminum nitride layer 116fully extends over intermediate segments 106 but does not extend overterminal segments 108, or only partially extends over intermediatesegments 106. For example, aluminum nitride layer 116 can providechemical protection where heating element contacts 132 are not preciselyaligned with terminal segments 108 or where heating element contacts 132are larger than shown in FIG. 6C. In one implementation, aluminumnitride layer 116 provides chemical protection to other structures (notshown in FIG. 6C) integrated with the PCM RF switch.

Aluminum nitride, layer 116 also protects the PCM RF switch againstshorting to heating element 102. As described above, a natural result ofetching optional conformability support layer 122, PCM 118, and optionalcontact uniformity support layer 124 is that stringers, such as stringer144 in FIG. 5, will form at an edge of PCM 1118. In the PCM RF switchstructure in FIG. 6C, aluminum nitride layer 116 intervenes between theedge of PCM 118 and heating element 102. Because, aluminum nitride layer116 provides electrical insulation, stringer 144 would not couple toheating element 102 and would not cause a short.

Thus, various implementations of the present application achieve ahighly reliable RF switch that overcomes the deficiencies in the art.From the above description it is manifest that various techniques can beused for implementing the concepts described in the present applicationwithout departing from the scope of those concepts. Moreover, while theconcepts have been described with specific reference to certainimplementations, a person of ordinary skill in the art would recognizethat changes can be made in form and detail without departing from thescope of those concepts. As such, the described implementations are tobe considered in all respects as illustrative and not restrictive. Itshould also be understood that the present application is not limited tothe particular implementations described above, but many rearrangements,modifications, and substitutions are possible without departing from thescope of the present disclosure.

1-10. (canceled)
 11. A method of manufacturing a radio frequency (RF)switch, the method comprising: providing a heating element; forming analuminum nitride layer over said heating element; forming a phase-changematerial (PCM) over said aluminum nitride layer such that an insidesegment of said heating element approximately underlies an activesegment of said PCM, and an intermediate segment of said heating elementis situated between a terminal segment of said heating element and saidinside segment of said heating element; wherein said aluminum nitridelayer at least partially extends over said intermediate segment of saidheating element for providing chemical protection to said intermediatesegment of said heating element, such that said intermediate segment ofsaid heating element remains substantially unetched and withsubstantially same thickness as said inside segment.
 12. The method ofclaim 11, further comprising forming heating element contact situatedover said terminal segment of said heating element.
 13. The method ofclaim 12, wherein said aluminum nitride layer performs as an etch stopduring said forming said heating element contact.
 14. The method ofclaim 11, further comprising forming a PCM contact situated over apassive segment of said PCM.
 15. The method of claim 11, wherein saidaluminum nitride layer prevents stringers at an edge of said PCM fromcoupling to said heating element.
 16. The method of claim 11, whereinsaid aluminum nitride layer is substantially planar.
 17. The method ofclaim 11, wherein said aluminum nitride layer is further formed over alower dielectric, has a first thermal conductivity over said lowerdielectric, and has a second thermal conductivity over said insidesegment of said heating element; said second thermal conductivity beinghigher than said first thermal conductivity, such that said aluminumnitride layer increases heat flow from said heating element in adirection toward said active segment of said PCM.
 18. The method ofclaim 11, wherein said heating element comprises material selected fromthe group consisting of tungsten (W), molybdenum (Mo), titanium (Ti),titanium nitride (TiN), titanium tungsten (TiW), tantalum (Ta), nickelchromium (NiCr), and nickel chromium silicon (NiCrSi).
 19. The method ofclaim 11, wherein said phase-change material is selected from the groupconsisting of germanium telluride (GeXTeY), germanium antimony telluride(GeXSbYTeZ), germanium selenide (GeXSeY), and any other chalcogenide.20. The method of claim 11, wherein said aluminum nitride layer has athickness greater than or approximately equal to five hundred angstromsand less than or approximately equal to five thousand angstroms (500Å-5,000 Å).
 21. A method of manufacturing a radio frequency (RF) switch,the method comprising: providing a heating element; forming a chemicallyprotective and thermally conductive layer over said heating element;forming a phase-change material (PCM) over said chemically protectiveand thermally conductive layer such that an inside segment of saidheating element approximately underlies an active segment of said PCMwherein an intermediate segment of said heating element is situatedbetween a terminal segment of said heating element and said insidesegment of said heating element; wherein said chemically protective andthermally conductive layer at least partially extends over saidintermediate segment.
 22. The method of claim 21, wherein saidchemically protective and thermally conductive layer provides chemicalprotection to said intermediate segment of said heating element, suchthat said intermediate segment of said heating element remainssubstantially unetched and with substantially same thickness as saidinside segment.
 23. The method of claim 21, wherein said chemicallyprotective and thermally conductive layer comprises a material selectedfrom the group consisting of aluminum nitride, aluminum oxide, berylliumoxide, silicon carbide, diamond, and diamond-like carbon.
 24. The methodof claim 21, further comprising forming a heating element contactsituated over said terminal segment of said heating element.
 25. Themethod of claim 24, wherein said chemically protective and thermallyconductive layer performs as an etch stop during said thrilling saidheating element contact.
 26. The method of claim 21, further comprisingforming a PCM contact situated over a passive segment of said PCM. 27.The method of claim 21, wherein said chemically protective and thermallyconductive layer is further formed over a lower dielectric, has a firstthermal conductivity over said lower dielectric, and has a secondthermal conductivity over said inside segment of said heating element,wherein said second thermal conductivity is higher than said firstthermal conductivity.
 28. The method of claim 21, wherein said heatingelement comprises material selected from the group consisting oftungsten (W), molybdenum (Mo), titanium (Ti), titanium nitride (TiN),titanium tungsten (TiW), tantalum (Ta), nickel chromium (NiCr), andnickel chromium silicon (NiCrSi).
 29. The method of claim 21, whereinsaid phase-change material is selected from the group consisting ofgermanium telluride (GeXTeY), germanium antimony telluride (GeXSbYTeZ),germanium selenide (GeMeY), and any other chalcogenide.
 30. The methodof claim 21, wherein said chemically protective and thermally conductivelayer prevents stringers at an edge of said PCM from coupling to saidheating element.